Special Section on Carbon Nanotubes

Carbon nanotubes for next generation very large scale integration interconnects

[+] Author Affiliations
Ashok Srivastava, Yao Xu

Louisiana State University, Department of Electrical and Computer Engineering, EE Building, 102 S. Campus Drive, Baton Rouge, Louisiana 70803-5901

Ashwani K. Sharma

AFRL/VSSE, Electronics Foundations Group, 3550 Aberdeen Avenue SE, Kirtland AFB, New Mexico 87117

J. Nanophoton. 4(1), 041690 (May 17, 2010). doi:10.1117/1.3446896
History: Received November 17, 2009; Revised April 19, 2010; Accepted April 20, 2010; May 17, 2010; Online May 17, 2010
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Abstract

We investigated the application of one-dimensional fluid model in modeling of electron transport in carbon nanotubes and equivalent circuits for interconnections and compared the performances with the currently used copper interconnects in very-large-scale integration (VLSI) circuits. In this model, electron transport in carbon nanotubes is regarded as quasi one-dimensional fluid with strong electron-electron interaction. Verilog-AMS in Cadence/Spectre was used in simulation studies. Carbon nanotubes of the types single-walled, multiwalled and bundles were considered for ballistic transport region, local and global interconnections. Study of the S-parameters showed higher transmission efficiency and lower reflection losses. Theoretical modeling and computer-aided simulation studies through a complimentary CNT-FET inverter pair, interconnected through a wire, exhibited reduced delays and power dissipations for carbon nanotube interconnects in comparison to copper interconnects in 22 nm and lower technology nodes. The performance of CNT interconnects was shown to be further improved with increase in number of metallic carbon nanotubes. Our study suggests the replacement of copper interconnect with the multiwalled and bundles of single-walled carbon nanotubes for the sub-nanometer CMOS technologies.

© 2010 Society of Photo-Optical Instrumentation Engineers

Citation

Ashok Srivastava ; Yao Xu and Ashwani K. Sharma
"Carbon nanotubes for next generation very large scale integration interconnects", J. Nanophoton. 4(1), 041690 (May 17, 2010). ; http://dx.doi.org/10.1117/1.3446896


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