Micronanosystems by bulk silicon micromachining

Masayoshi Esashi

doi:10.1117/12.448971

21 November 2001 Micronanosystems by bulk silicon micromachining

Masayoshi Esashi

Proceedings Volume 4592, Device and Process Technologies for MEMS and Microelectronics II; (2001) https://doi.org/10.1117/12.448971
Event: International Symposium on Microelectronics and MEMS, 2001, Adelaide, Australia

Abstract

Wafer process packaging using electrical feedthrough from glass holes has been applied for micromechanical sensors as electrostatically levitating micro motors (10,000 rpm) for rotational gyroscopes. Active catheters and sensors have been developed as maintenance tools used in narrow space. Silicon microstructures made by the deep RIE was used as molds for making ceramic microstructures. Hydrogen storage capacity of carbon nanotube was measured from the resonant frequency change of thin silicon cantilever which have the carbon nanotube on it. Multiprobe data storage devices have been fabricated using thermal probes of which tip size is 30 nm. The electrical feedthrough from the multiprobe was fabricated in a Pyrex glass plate by using Deep RIE (Reactive Ion Etching) and nickel electroplating. High density data recording to a phase change media (GeSbTe) was performed.

Citation Download Citation

Masayoshi Esashi "Micronanosystems by bulk silicon micromachining", Proc. SPIE 4592, Device and Process Technologies for MEMS and Microelectronics II, (21 November 2001); https://doi.org/10.1117/12.448971

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