Dual-layer dye-filled developer-soluble BARCs for 193-nm lithography

Jim D. Meador; Carol Beaman; Charlyn Stroud; Joyce A. Lowes; Zhimin Zhu; Douglas J. Guerrero; Ramil-Marcelo L. Mercado; David Drain

doi:10.1117/12.772793

15 April 2008 Dual-layer dye-filled developer-soluble BARCs for 193-nm lithography

Jim D. Meador, Carol Beaman, Charlyn Stroud, Joyce A. Lowes, Zhimin Zhu, Douglas J. Guerrero, Ramil-Marcelo L. Mercado, David Drain

Author Affiliations +

Proceedings Volume 6923, Advances in Resist Materials and Processing Technology XXV; 69232W (2008) https://doi.org/10.1117/12.772793
Event: SPIE Advanced Lithography, 2008, San Jose, California, United States

Abstract

A family of dye-filled developer-soluble bottom anti-reflective coatings (BARCs) has been developed for use in 193-nm microlithography. This new dye-filled chemical platform easily provides products covering a wide range of optical properties. The light-sensitive and positive-working BARCs use a transparent polymeric binder and a polymeric dye in a thermally crosslinking formulation, with the cured products then being photochemically decrosslinked prior to development. The cured BARC films are imaged and removed with developer in the same steps as the covering photoresist. Two dye-filled BARCs with differing optical properties were developed via a series of DOEs and then used as a dual-layer BARC stack. Lithography with this BARC stack, using a 193-nm resist, gave 150-nm L/S (1:1). A 193-nm dual-layer BARC stack (gradient optical properties) from the well-established dye-attached family of light-sensitive BARCs also gave 150-nm L/S (1:1) with the same resist. However, the latter provided much improved line shape with no scumming. The targeted application for light-sensitive dual-layer BARCs is high-numerical aperture (NA) immersion lithography where a single-layer BARC will not afford the requisite reflection control.

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Jim D. Meador, Carol Beaman, Charlyn Stroud, Joyce A. Lowes, Zhimin Zhu, Douglas J. Guerrero, Ramil-Marcelo L. Mercado, and David Drain "Dual-layer dye-filled developer-soluble BARCs for 193-nm lithography", Proc. SPIE 6923, Advances in Resist Materials and Processing Technology XXV, 69232W (15 April 2008); https://doi.org/10.1117/12.772793

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