New methods and instrumentation for functional, yield and reliability testing of MEMS on device, chip and wafer level

Ingrid De Wolf; Jeroen De Coster; Vladimir Cherman; Piotr Czarnecki; Stanislaw Kalicinski; Olalla Varela Pedreira; Sandeep Sangameswaran; Kris Vanstreels

doi:10.1117/12.820977

18 May 2009 New methods and instrumentation for functional, yield and reliability testing of MEMS on device, chip and wafer level

Ingrid De Wolf, Jeroen De Coster, Vladimir Cherman, Piotr Czarnecki, Stanislaw Kalicinski, Olalla Varela Pedreira, Sandeep Sangameswaran, Kris Vanstreels

Author Affiliations +

Proceedings Volume 7362, Smart Sensors, Actuators, and MEMS IV; 73620N (2009) https://doi.org/10.1117/12.820977
Event: SPIE Europe Microtechnologies for the New Millennium, 2009, Dresden, Germany

Abstract

In this paper various non-standard methods and instruments for the functional, yield and reliability analysis of MEMS are discussed. Most of these methods are based on existing instruments, involving electrical, optical or mechanical measurements. We present either alternative applications of existing techniques, new methodology for data extraction, or adaptation/automation of the techniques for automatic chip or wafer level measurements.

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Ingrid De Wolf, Jeroen De Coster, Vladimir Cherman, Piotr Czarnecki, Stanislaw Kalicinski, Olalla Varela Pedreira, Sandeep Sangameswaran, and Kris Vanstreels "New methods and instrumentation for functional, yield and reliability testing of MEMS on device, chip and wafer level", Proc. SPIE 7362, Smart Sensors, Actuators, and MEMS IV, 73620N (18 May 2009); https://doi.org/10.1117/12.820977

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