Paper
24 August 2010 Fabrication of 3D nanostructures with lithographically patterned surfaces by self-folding
Jeong-Hyun Cho, Teena James, D. H. Gracias
Author Affiliations +
Abstract
One of the important challenges in nanoscale manufacturing is the construction of simultaneously patterned three dimensional structures, materials and devices. Since we live in a three dimensional world, such capabilities are needed to fully realize the capabilities of nanotechnology. We describe self-assembly processes based on utilizing intrinsic stress and inducing grain coalescence (extrinsic stress) in thin metal films that can be used to curve or fold lithographically patterned two dimensional (2D) panels into 3D structures. We discuss the use of intrinsic chromium (Cr) stresses and extrinsic stresses based on induced grain coalescence in tin (Sn) based structures with varying material composition to create a variety of lithographically patterned curved and polyhedral structures.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jeong-Hyun Cho, Teena James, and D. H. Gracias "Fabrication of 3D nanostructures with lithographically patterned surfaces by self-folding", Proc. SPIE 7767, Instrumentation, Metrology, and Standards for Nanomanufacturing IV, 776704 (24 August 2010); https://doi.org/10.1117/12.859688
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Cited by 3 scholarly publications.
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KEYWORDS
Tin

Nickel

Silicon

Chromium

Electron beam lithography

Etching

Plasma etching

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