Research on an Al\SiNx bi-material thermal-mechanical uncooled infrared FPA pixel

Xia Zhang; Da-cheng Zhang

doi:10.1117/12.900491

8 September 2011 Research on an AlSiN_x bi-material thermal-mechanical uncooled infrared FPA pixel

Xia Zhang, Da-cheng Zhang

Proceedings Volume 8193, International Symposium on Photoelectronic Detection and Imaging 2011: Advances in Infrared Imaging and Applications; 81932M (2011) https://doi.org/10.1117/12.900491
Event: International Symposium on Photoelectronic Detection and Imaging 2011, 2011, Beijing, China

Abstract

AlSiN_x bi-material thermal strain structure is used in uncooled optic readout infrared focal plane array (UOR IR FPA) pixel based on Micro-Electro-Mechanical Systems (MEMS) technology. In this paper, the problems that the AlSiN_xstructure prevents FPA pixel scaling down and fill factor improving, and the Au reflection layer of the pixel leads to larger readout light energy loss are analyzed. The feasibility of AlSiN_x instead of AlSiN_x in the UOR IR FPA fabrication is researched in detail. The theoretical analyzing and simulation results demonstrate that, with optimized thicknesses and their matching designing of SiN_x and Al, the thermal-mechanical response of AlSiN_x bi-material structure is improved to 1.8 times and the intensity of optic readout signal is improved to about 2 times compared with AuSiNAlSiN_x one.

Citation Download Citation

Xia Zhang and Da-cheng Zhang "Research on an AlSiN_x bi-material thermal-mechanical uncooled infrared FPA pixel", Proc. SPIE 8193, International Symposium on Photoelectronic Detection and Imaging 2011: Advances in Infrared Imaging and Applications, 81932M (8 September 2011); https://doi.org/10.1117/12.900491

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