Interlayer verification methodology for multi-patterning processes

Sunwook Jung; Sejin Park; Jungmin Kim; Jinhee Kim; John Sturtevant

doi:10.1117/12.2258356

28 March 2017 Interlayer verification methodology for multi-patterning processes

Sunwook Jung, Sejin Park, Jungmin Kim, Jinhee Kim, John Sturtevant

Proceedings Volume 10147, Optical Microlithography XXX; 101470J (2017) https://doi.org/10.1117/12.2258356
Event: SPIE Advanced Lithography, 2017, San Jose, California, United States

Abstract

Various multi-patterning processes with associated design methodologies have been deployed to address patterning challenges of ArFi and alternate solutions such as EUV, DSA or nanoimprint. Process variability prediction through compact models is sometimes limited to those multipatterning processes used to compose single final target. We may call those sequential processes as representative module for design target layer which is not clearly derived from single litho-etch process but derived from the interaction between various layers. Key challenges for extending multiple pattering are managing design and tolerance variation in multiple pattering steps with proper restrictions, and visualizing interlayer errors (w/ bridge & pinch and overlap). Additionally,visualization of final target layers and intermediate layers is important for process/design engineers.

We will demonstrate verification flows for different process modules to verify the failure mechanisms and to aid in visualization, then judge the areas for improvement with existing model based solutions. Then we will also try to investigate possible area for development of accurate residual error prediction from compact models as those errors are accumulated from multiple process effects into final CD measurement from design target layers. This may lead to new dimensions of modeling process effects we’ve never considered because those signatures were lumped between processes to processes.

Citation Download Citation

Sunwook Jung, Sejin Park, Jungmin Kim, Jinhee Kim, and John Sturtevant "Interlayer verification methodology for multi-patterning processes", Proc. SPIE 10147, Optical Microlithography XXX, 101470J (28 March 2017); https://doi.org/10.1117/12.2258356

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available