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Semiconductor technology nodes are steadily miniaturizing. On the other hand, various efforts have
been made to reduce costs, mass production lines have shifted from 200 mmφ of Si wafer to 300 mmφ,
and technology development of Si wafer 450 mmφ is also in progress.
As a photomask, 6-inch size binary Cr mask has been used for many years, but in recent years, the use
of 9-inch binary Cr masks for Proximity Lithography Process in automotive applications, MEMS,
packages, etc. has increased, and cost reduction has been taken.
Since the miniaturization will progress in the above applications in the future, products corresponding
to miniaturization are also desired in 9-inch photomasks.
The high grade Cr - binary mask blanks used in proximity exposure process, there is a prospect of
being able to use it by ULVAC COATING CORPORATION's tireless research. As further demands for
miniaturization, KrF and ArF Lithography Process, which are used for steppers and scanners , there are
also a demand for 9-inch size Mask Blanks.
In ULVAC COATING CORPORATION, we developed a 9 - inch size KrF PSM mask Blanks
prototype in 2016 and proposed a new high grade 9 - inch photomask. This time, we have further
investigated and developed 9-inch size ArF PSM Mask Blanks corresponding to ArF Lithography
Process, so we report it.
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