Paper
31 August 2018 Biometric method to improve super resolution structure on AI and deep learning
Hua Liu, Helong Wang, Quanxin Ding, Chunjie Guo, Liwei Zhou
Author Affiliations +
Proceedings Volume 10835, Global Intelligence Industry Conference (GIIC 2018); 1083504 (2018) https://doi.org/10.1117/12.2504701
Event: Global Intelligent Industry Conference 2018, 2018, Beijing, China
Abstract
To solve the biometric technology based on artificial intelligence and deep learning, to improve the system resolution is an important aspect of the development of a complicated sensor. In order to improve the resolution of the imaging system, and achieve the theoretical limit, we introduced the technology principle of super resolution restructure from the point of view on theory and engineering. Several methods to realize high resolution restructure configurations are introduced based on theoretical analysis and engineering practice. Then, three kinds of restructure technologies, that prototype, micro scanning and sub pixel are described, and how to decrease their shortcomings are discussed in detail. The results support theoretical case.
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hua Liu, Helong Wang, Quanxin Ding, Chunjie Guo, and Liwei Zhou "Biometric method to improve super resolution structure on AI and deep learning", Proc. SPIE 10835, Global Intelligence Industry Conference (GIIC 2018), 1083504 (31 August 2018); https://doi.org/10.1117/12.2504701
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KEYWORDS
Artificial intelligence

Complex systems

Biometrics

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