Study on the residual stress during fused silica: traverse oscillating cutting process

Dongbai Xue; Peng Wang; Yiqin Ji; Tianyu Zhao

doi:10.1117/12.2506853

16 January 2019 Study on the residual stress during fused silica: traverse oscillating cutting process

Dongbai Xue, Peng Wang, Yiqin Ji, Tianyu Zhao

Proceedings Volume 10838, 9th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies; 108381M (2019) https://doi.org/10.1117/12.2506853
Event: Ninth International Symposium on Advanced Optical Manufacturing and Testing Technologies (AOMATT2018), 2018, Chengdu, China

Abstract

Traverse oscillating cutting is one of the cutoff process with low cutting forces, low contact zone, favorable cooling, long cutting time which is suitable for hard and brittle materials. The cutting process will generate residual stress, which affects the surface profile and mechanical properties. In this paper, the fused silica glass is selected to carry out the cutting experiment. The effect of the two cutting modes, horizontal cutting and longitudinal cutting on the residual stress was studied experimentally. And the parameters such as rotating speed, feed speed and cutting depth were optimized. The results show that both cutting modes produce large residual stress at the edge, while the horizontal cutting in the middle region produces smaller residual stress. There is no significant linear relationship between the parameters and residual stress, which has an optimal range. And an optimal traverse oscillating cutting technique is obtained.

Citation Download Citation

Dongbai Xue, Peng Wang, Yiqin Ji, and Tianyu Zhao "Study on the residual stress during fused silica: traverse oscillating cutting process", Proc. SPIE 10838, 9th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 108381M (16 January 2019); https://doi.org/10.1117/12.2506853

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