Most compact and versatile 3D marking system

Albert Seifert; Stefan Marzenell; Wolfram Schöne; Steffen Ehrenmann

doi:10.1117/12.2510110

27 February 2019 Most compact and versatile 3D marking system

Albert Seifert, Stefan Marzenell, Wolfram Schöne, Steffen Ehrenmann

Proceedings Volume 10911, High-Power Laser Materials Processing: Applications, Diagnostics, and Systems VIII; 109110B (2019) https://doi.org/10.1117/12.2510110
Event: SPIE LASE, 2019, San Francisco, California, United States

Abstract

The demand for marking systems to create durable marks has led to a significant growth of lasers in manufacturing. Qswitched nanosecond pulsed solid state or fiber lasers are used for most of the marking applications today. Manufacturer of marking systems have pushed this growth by providing more powerful or more compact systems. We were able to reduce the overall size of the 3D laser marking head to approx. ½ cubic foot. This reduction in size was possible due to improved pump sources providing higher brightness, improved laser designs, improved electronic design and state of the art packaging technology. The size of approx. 1/2 cubic foot is the most compact full 3D marking system available. In addition, our new laser marking system based on a diode pumped solid state laser shows superior performance compared to laser marking systems based on fiber lasers of the same or even higher average power. We will show marking applications in terms of black engraving, annealing and high quality bitmap marking. Due to the optimized optical layout of the 3D marking system, it is possible to mark 3D shaped objects using the same laser parameters even with objects of different heights. We will present results of a 3D annealing application. Additionally, to achieve high productivity, the laser has to be integrated very easily into the production system in terms of mechanics, optics and software control.

Conference Presentation

Citation Download Citation

Albert Seifert, Stefan Marzenell, Wolfram Schöne, and Steffen Ehrenmann "Most compact and versatile 3D marking system", Proc. SPIE 10911, High-Power Laser Materials Processing: Applications, Diagnostics, and Systems VIII, 109110B (27 February 2019); https://doi.org/10.1117/12.2510110

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