Presentation + Paper
20 March 2019 Persistent homology analysis of complex high-dimensional layout configurations for IC physical designs
Author Affiliations +
Abstract
Problems in simulation, in physical defects, or in electrical failures of the IC devices generally occur at the boundaries of dimensional tolerances, such as the minimum width and space. However, for layout configurations with four or more critical dimensions, simple minimums are insufficient to characterize dimensional coverage. Persistent homology is a multi-resolution analysis technique which robustly summarizes dimensional coverage. We apply this technique to compare dimensional coverage of IC design configurations, on the same layer, on different layers, and on different designs, yielding results both expected and unexpected based on manufacturing process and design rule knowledge.
Conference Presentation
© (2019) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yacoub Kureh, Vito Dai, and Luigi Capodieci "Persistent homology analysis of complex high-dimensional layout configurations for IC physical designs", Proc. SPIE 10962, Design-Process-Technology Co-optimization for Manufacturability XIII, 1096207 (20 March 2019); https://doi.org/10.1117/12.2516583
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KEYWORDS
Clouds

Manufacturing

Computer aided design

Mirrors

Visualization

Data analysis

Distance measurement

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