Presentation + Paper
4 March 2022 Effect of stress on the temperature coefficient of solder-free mounted laser diode bars
Author Affiliations +
Abstract
Variation of lasing wavelength with temperature is a key factor to determine packaging thermal resistance in laser diodes. Using proprietary mounting technology that clamps laser bars instead of using soldering material we can precisely control the stress applied on the laser bars. We experimentally demonstrate that uniaxial stress in the normal direction of the p-n junction (which results in tensile stress in the lattice) increases the temperature characteristic of laser diodes. We report a temperature characteristic raise between 10% and 50% under different stress conditions.
Conference Presentation
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Carles Oriach-Font, Eduard Carbonell-Sanromà, Gemma Safont-Camprubí, Sandra Tricas-Mendoza, and Clàudia Garcia-Cubero "Effect of stress on the temperature coefficient of solder-free mounted laser diode bars", Proc. SPIE 11982, Components and Packaging for Laser Systems VIII, 1198209 (4 March 2022); https://doi.org/10.1117/12.2608795
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KEYWORDS
Semiconductor lasers

Resistance

Wavelength tuning

Packaging

Electro optics

Polarization

Edge emitting semiconductor lasers

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