The metrology FOUP (M-FOUP) is a self-contained metrology tool in a wafer carrier. This metrology concept, which was designed and manufactured by SEMILAB, is actively being evaluated in GLOBALFOUNDRIES. The M-FOUP system consists of a controller (MCONTROLLER), which controls multiple M-FOUP measurement units. Each independently operated M-FOUP unit utilizes a multi-point spectroscopic reflectometry technique, which can be used for many thickness applications. The self-contained metrology device has advantages over traditional film thickness measurement tools including reduced cost, significantly smaller footprint, and increased availability. In a previous article we focused on the technical details of the M-FOUP unit such as the overall design, the temperature distribution, charging/discharging routine, typical spectra, and typical wafer map. The focus of this work is on integrating the M-FOUP system into a semiconductor fab environment. This requires a high-level orchestration of multiple fab systems including the automated material handling system (AMHS), real-time dispatching (RTD) system and the MFOUP system itself. The management of the metrology jobs and data collection using M-FOUP from a point of view of Manufacturing Execution System (MES) are discussed.
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