A review on efficient heat-dissipating coatings for applications in thermal management technology of electronic components

Yuxuan Xu; Guoyao Xiong; Peng Li

doi:10.1117/12.2634890

25 April 2022 A review on efficient heat-dissipating coatings for applications in thermal management technology of electronic components

Yuxuan Xu, Guoyao Xiong, Peng Li

Author Affiliations +

Proceedings Volume 12244, 2nd International Conference on Mechanical, Electronics, and Electrical and Automation Control (METMS 2022); 122442I (2022) https://doi.org/10.1117/12.2634890
Event: 2nd International Conference on Mechanical, Electronics, and Electrical and Automation Control (METMS 2022), 2022, Guilin, China

Abstract

Recently, ever-increasing requirements of the application environment with respect to working efficiency, environmental adaptability and energy efficiency, it is impossible for traditional active heat dissipation technologies to adapt to the needs of modern electronic components which are miniaturised and highly integrated. To achieve high heat flux conduction in micro spaces, for example, it will significantly reduce the utilization ratio of internal space of electronic components if we use traditional cooling techniques such as wind cooling and water cooling. In this and similar applications, a heat dissipation system which can improves both heat flux density and utilization ratio of space is urgently needed, while efficient heat-dissipating coatings can perfectly fit for this application requirement, addressing the limitations that problems of heat dissipation present in the development of this realm. In this paper we review the research status of efficient heat-dissipating coatings at home and abroad and analyse the rational application of heatdissipating coatings, especially those working in infrared radiation mode, under different requirements.

Citation Download Citation

Yuxuan Xu, Guoyao Xiong, and Peng Li "A review on efficient heat-dissipating coatings for applications in thermal management technology of electronic components", Proc. SPIE 12244, 2nd International Conference on Mechanical, Electronics, and Electrical and Automation Control (METMS 2022), 122442I (25 April 2022); https://doi.org/10.1117/12.2634890

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