Automatic evaluation of line-and-space resist patterns with defects using image recognition technology

Yuqing Jin; Takahiro Kozawa; Kota Aoki; Tomoya Nakamura; Yasushi Makihara; Yasushi Yagi

doi:10.1117/12.2685766

21 November 2023 Automatic evaluation of line-and-space resist patterns with defects using image recognition technology

Yuqing Jin, Takahiro Kozawa, Kota Aoki, Tomoya Nakamura, Yasushi Makihara, Yasushi Yagi

Proceedings Volume 12750, International Conference on Extreme Ultraviolet Lithography 2023; 1275015 (2023) https://doi.org/10.1117/12.2685766
Event: SPIE Photomask Technology + EUV Lithography, 2023, Monterey, California, United States

Conference Poster

Abstract

New resist materials are necessary to achieve higher resolution for the high NA EUV tools. The feature size shrinkage also increases the possibility of defect generation. Therefore, controlling defects remains essential. There are many factors in the lithography process that can contribute to the formation of defects in resist patterns. As a result, when testing the new resist material for patterning, there are more instances of pattern failures than successful ones. However, understanding pattern flaws can gain knowledge about the mechanism of defect generation. Based on the idea that exploiting the information in pattern failures can guide the resist resolution improvement, this study presents a novel method of interpreting patterns with defects based on an image recognition technology named Hough transformation. Approximate 2500 SEM images and part of corresponding simulation results were automatically analyzed. These results were then utilized to extract chemical information.

(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Yuqing Jin, Takahiro Kozawa, Kota Aoki, Tomoya Nakamura, Yasushi Makihara, and Yasushi Yagi "Automatic evaluation of line-and-space resist patterns with defects using image recognition technology", Proc. SPIE 12750, International Conference on Extreme Ultraviolet Lithography 2023, 1275015 (21 November 2023); https://doi.org/10.1117/12.2685766

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