Machine, process, and material efforts towards sustainable lithography

Andreia Santos; Wesley Zanders; Elke Caron; Seungjoo Baek; Seonggil Heo; Jelle Vandereyken; Hyo Seon Suh; Douglas J. Guerrero; Masahiko Harumoto; Tsuyoshi Mitsuashi

doi:10.1117/12.3010506

10 April 2024 Machine, process, and material efforts towards sustainable lithography

Andreia Santos, Wesley Zanders, Elke Caron, Seungjoo Baek, Seonggil Heo, Jelle Vandereyken, Hyo Seon Suh, Douglas J. Guerrero, Masahiko Harumoto, Tsuyoshi Mitsuashi

Author Affiliations +

Proceedings Volume 12957, Advances in Patterning Materials and Processes XLI; 1295717 (2024) https://doi.org/10.1117/12.3010506
Event: SPIE Advanced Lithography + Patterning, 2024, San Jose, California, United States

Abstract

As the awareness of climate change and sustainability grows, industries are placing more commitment to reduce their environmental footprint. Semiconductor companies are no exception, and many are now working to reduce their greenhouse gas (GHG) emissions and adopt greener practices as crucial steps towards a more environmentally responsible future. Amongst the top sustainability challenges faced in semiconductor manufacturing, electricity consumption emerges as a critical concern, with lithography tools requiring a substantial amount of energy to operate. As a track vendor, reducing energy consumption and optimizing tool efficiency are ongoing challenges at SCREEN, where hotplate processes rank amongst the most energy-intensive operations, especially during the bake of underlayer materials that require high temperatures to achieve full film densification. This paper shows an innovative energy-efficient process as a viable alternative to conventional spin-on carbon (SOC) and spin-on glass (SOG) thermal crosslinking systems. We deeply explore the feasibility to use an overall-wafer exposure system integrated on SCREEN’s DT-3000 track to harden underlayer materials specifically designed to crosslink via light, without the need of heat. We demonstrate how migration from a hotplate process to a 100% optical curing mechanism can lead to outstanding savings in energy and process time, while keeping the lithographic performance.

Conference Presentation

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Andreia Santos, Wesley Zanders, Elke Caron, Seungjoo Baek, Seonggil Heo, Jelle Vandereyken, Hyo Seon Suh, Douglas J. Guerrero, Masahiko Harumoto, and Tsuyoshi Mitsuashi "Machine, process, and material efforts towards sustainable lithography", Proc. SPIE 12957, Advances in Patterning Materials and Processes XLI, 1295717 (10 April 2024); https://doi.org/10.1117/12.3010506

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