Metasurface-based depth sensing and topology optimized high-Q metasurfaces

Yao-Wei Huang

doi:10.1117/12.3027996

2 October 2024 Metasurface-based depth sensing and topology optimized high-Q metasurfaces

Yao-Wei Huang

Proceedings Volume 13111, Plasmonics: Design, Materials, Fabrication, Characterization, and Applications XXII; 1311105 (2024) https://doi.org/10.1117/12.3027996
Event: Nanoscience + Engineering, 2024, San Diego, California, United States

Abstract

In this invited talk, I will present our recent developments and applications of dielectric metasurfaces in depth sensing, facial recognition, and topology-optimized high-Q metasurfaces. In the first part, we demonstrate a commercially compatible metasurface-based dot projector that integrates a metasurface hologram with photonic crystal surfaceemitting laser (PCSEL). Compared to conventional dot projectors, our approach achieves a 233-fold reduction in area, a 10.8-fold decrease in power consumption, a 1.43-fold increase in the number of near-infrared dots, and a twofold expansion in field-of-view (FOV). In the second part, we introduce a novel topology-optimized nonlocal metasurface that operates simultaneously at red, yellow, green, and blue wavelengths. Unlike local metasurfaces with broadband and broad-angle responses, nonlocal metasurfaces, exemplified by resonant waveguide gratings (RWGs), spatially and angularly configure optical wavefronts through narrow-band resonant modes. Our metasurface resonant waveguide grating (MRWG), designed using higher efficiency techniques compared to traditional RWGs, demonstrates experimental efficiencies up to 59% with a quality factor (Q-factor) of 93. It is also applied to achieve color selectivity, producing vivid colors at four narrow-band wavelengths with narrow-angle responses.

Conference Presentation

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Yao-Wei Huang "Metasurface-based depth sensing and topology optimized high-Q metasurfaces", Proc. SPIE 13111, Plasmonics: Design, Materials, Fabrication, Characterization, and Applications XXII, 1311105 (2 October 2024); https://doi.org/10.1117/12.3027996

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