Three-dimensional (3D) Structured illumination microscopy (SIM) has become one of the most commonly implemented fluorescence super-resolution modes in life sciences due to its unique advantages of wide field of view, fast imaging, and weak phototoxicity and photobleaching. However, the traditional two-dimensional (2D) SIM suffers from the "missing cone” problem, which makes it impossible to realize true three-dimensional (3D) imaging. In order to solve this problem, 3D SIM has been developed to achieve twice the resolution in both lateral and axial directions. Recently, we propose a tiled and layer-adaptive 3D SIM based on principal component analysis (PCA) to solve the computational complexity and time-consuming, local perturbation of illumination parameters, and microscope moving mechanical errors faced by 3D SIM in parameter estimation. The algorithm accelerates and improves the accuracy of transverse and axial illumination parameters, which is expected to achieve fast, iteration-free, high-precision, high-quality 3D SIM super-resolution imaging.
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