Paper
4 December 2024 Study of chip defect detection based on photoacoustic effect
Chunhui Li, Yuye Wang, Degang Xu, Jianquan Yao
Author Affiliations +
Proceedings Volume 13283, Conference on Spectral Technology and Applications (CSTA 2024); 132835L (2024) https://doi.org/10.1117/12.3051952
Event: Conference on Spectral Technology and Applications (CSTA 2024), 2024, Dalian, China
Abstract
As an important part of the current electronic information industry, chip defects will affect the reliability of the chip, therefore, there is a great demand for chip defect detection. Photoacoustic detection, as a new detection technology, has deeper penetration depth than infrared detection, lower risk than X-ray detection, and better image resolution and contrast than ultrasonic detection, making photoacoustic detection has application value in the field of chip defect detection. In this work, photoacoustic detection of chip was performed using acoustic resolution photoacoustic microscopy (AR-PAM), where the droplet of ultra-pure water was used as a coupling agent. The time domain waveform inside the chip was extracted and analyzed. It can be found that the waveforms of the defect area showed clear difference from that of the normal area. The results indicated that photoacoustic effect is feasible to be applied in the field of internal defect detection of chips. It can provide a new technique for chip defect detection.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Chunhui Li, Yuye Wang, Degang Xu, and Jianquan Yao "Study of chip defect detection based on photoacoustic effect", Proc. SPIE 13283, Conference on Spectral Technology and Applications (CSTA 2024), 132835L (4 December 2024); https://doi.org/10.1117/12.3051952
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KEYWORDS
Photoacoustic spectroscopy

Defect detection

Laser ultrasonics

Ultrasonics

Plastics

Reflection

Acoustics

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