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1 April 1991 Packaging technology for the NEC SX-3 supercomputers
Hiroshi Murano, Toshihiko Watari
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Proceedings Volume 1390, Microelectronic Interconnects and Packages: System and Process Integration; (1991) https://doi.org/10.1117/12.25572
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States
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Hiroshi Murano and Toshihiko Watari "Packaging technology for the NEC SX-3 supercomputers", Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); https://doi.org/10.1117/12.25572
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