Hybrid wafer scale packaging of laser diodes and multichip module technology

Paul O. Haugsjaa; Craig A. Armiento; Paul Melman

doi:10.1117/12.59176

26 June 1992 Hybrid wafer scale packaging of laser diodes and multichip module technology

Paul O. Haugsjaa, Craig A. Armiento, Paul Melman

Proceedings Volume 1634, Laser Diode Technology and Applications IV; (1992) https://doi.org/10.1117/12.59176
Event: OE/LASE '92, 1992, Los Angeles, CA, United States

Abstract

Although optoelectronic components are used widely in the telecommunications industry, this technology has barely touched the potential of what could be vast markets in broadband local loop and computer interconnection applications. The reliability, performance and particularly the cost of optoelectronic components must be improved for these applications to develop. Issues involving component packaging to a large extent determine the level to which these application criteria are met.1 This paper explores advances in semiconductor laser packaging that are aimed at reaching levels of component integration required for extensive use of optoelectronics in computer and communications systems applications.

Citation Download Citation

Paul O. Haugsjaa, Craig A. Armiento, and Paul Melman "Hybrid wafer scale packaging of laser diodes and multichip module technology", Proc. SPIE 1634, Laser Diode Technology and Applications IV, (26 June 1992); https://doi.org/10.1117/12.59176

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