Characterization of safe solvent PMMA resist variables for electron-beam application

Bruce W. Smith; Todd D. Eakin; Donald W. Johnson

doi:10.1117/12.175825

13 May 1994 Characterization of safe solvent PMMA resist variables for electron-beam application

Bruce W. Smith, Todd D. Eakin, Donald W. Johnson

Proceedings Volume 2194, Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing IV; (1994) https://doi.org/10.1117/12.175825
Event: SPIE's 1994 Symposium on Microlithography, 1994, San Jose, CA, United States

Abstract

Results are presented from a study undertaken to evaluate resist casting solvent composition and molecular weight variation in PMMA for electron beam exposure. PMMA cast in several solvent systems have been evaluated for lithographic performance. Additionally, formulations in chlorobenzene with minor variations in molecular weight have been evaluated for batch-to- batch uniformity. A 10 KeV MEBES electron beam system has been used to study resist sensitivity, contrast, and process latitude. Using a two-factor, three level factorial designed experiment, prebake and development time have been varied as controlled process factors. Samples with varying molecular weights were shown to have wide process latitude. These samples gave comparable performance while their molecular weights varied from 539 K to 614 K, and polydispersity varied from 3.3 to 6.1. Resist samples with chlorobenzene, PGMEA (propylene glycol monomethyl ether acetate), and anisole as the casting solvent resulted in equivalent performance.

Citation Download Citation

Bruce W. Smith, Todd D. Eakin, and Donald W. Johnson "Characterization of safe solvent PMMA resist variables for electron-beam application", Proc. SPIE 2194, Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing IV, (13 May 1994); https://doi.org/10.1117/12.175825

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