Paper
16 October 1995 Microstress in high-pressure temperature-treated Czochralski-grown silicon with oxygen concentration up to 1.2x 1018 cm-3
Andrzej Misiuk
Author Affiliations +
Proceedings Volume 2373, Solid State Crystals: Materials Science and Applications; (1995) https://doi.org/10.1117/12.224977
Event: Solid State Crystals: Materials Science and Applications, 1994, Zakopane, Poland
Abstract
Phenomena related to microstress at the SiOx/Si boundary in Czochralski grown silicon single crystals with the initial interstitial oxygen concentration up to 1.2 multiplied by 1018 cm-3, subjected to annealing at up to 1620 K under hydrostatic pressure up to 1.35 GPa, were investigated by deep-level transient spectroscopy (DLTS), selective etching, Fourier transform infrared spectroscopy (FTIR), and x ray methods. Depending on treatment conditions the enhanced microstress at the SiOx/Si boundary, creation of additional nucleation centers, and change of precipitate critical radius can promote oxygen precipitation (retard OP dissolution) also causing creation of additional defects. Qualitative explanation of some observed phenomena is proposed.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Andrzej Misiuk "Microstress in high-pressure temperature-treated Czochralski-grown silicon with oxygen concentration up to 1.2x 1018 cm-3", Proc. SPIE 2373, Solid State Crystals: Materials Science and Applications, (16 October 1995); https://doi.org/10.1117/12.224977
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KEYWORDS
Oxygen

Silicon

Protactinium

Chemical species

Etching

Information operations

Crystals

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