Key issues in evaluating hot-carrier reliability

James E. Chung

doi:10.1117/12.250889

13 September 1996 Key issues in evaluating hot-carrier reliability

James E. Chung

Proceedings Volume 2875, Microelectronic Device and Multilevel Interconnection Technology II; (1996) https://doi.org/10.1117/12.250889
Event: Microelectronic Manufacturing 1996, 1996, Austin, TX, United States

Abstract

Two key issues in evaluating the hot-carrier reliability of CMOS device technologies will be examined. First, the basis for establishing hot-carrier reliability criteria will be analyzed. The case will be made for incorporating information about circuit performance requirements and operating conditions into future hot-carrier reliability criteria rather than relying on more ambiguous criteria defined by device-performance requirements alone. Second, the impact of lower operating voltages on hot-carrier reliability criteria and models will be analyzed. An assessment will be made of the future significance and impact of hot-carrier degradation for future scaled CMOS technologies.

Citation Download Citation

James E. Chung "Key issues in evaluating hot-carrier reliability", Proc. SPIE 2875, Microelectronic Device and Multilevel Interconnection Technology II, (13 September 1996); https://doi.org/10.1117/12.250889

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