Laser processes for multichip module's high-density multilevel thin film packaging

Rajesh S. Patel; Thomas A. Wassick

doi:10.1117/12.273739

9 May 1997 Laser processes for multichip module's high-density multilevel thin film packaging

Rajesh S. Patel, Thomas A. Wassick

Proceedings Volume 2991, Laser Applications in Microelectronic and Optoelectronic Manufacturing II; (1997) https://doi.org/10.1117/12.273739
Event: Photonics West '97, 1997, San Jose, CA, United States

Abstract

Today multichip modules (MCMs) have found applications in a variety of fields including computers, telecommunication, automotive industry, and medical diagnosis devices. Lasers are being used as a processing tool for fabricating high density multilevel thin film packages for MCMs. The two most commonly practiced laser processes for multilevel thin film packaging are, laser via ablation and laser based circuit repair processes. Laser via ablation is used for creating via holes in polyimide to provide vertical connection between two adjacent layers of multilevel thin film. It is a dry, precise, and highly robust patterning technology available today in packaging industry. The three major aspects of via ablation technology are ablation process, mask technology, and tooling. IBM has pioneered the laser via ablation technology and has developed all three aspects to use it as a primary technology for via formation for thin film packages. Laser based circuit repair processes have also been developed to a mature state where they are being used on a routine basis to repair circuits in multilevel thin film packages. The need for repair of circuit arises for variety of reasons including, contamination, yield improvement, to accommodate engineering changes or to correct design errors. The commonly practiced laser based repair processes are deleting metal shorts using a laser, depositing metal using laser chemical vapor deposition technique, and stitching metal lines using laser sonic bonding technique.

Citation Download Citation

Rajesh S. Patel and Thomas A. Wassick "Laser processes for multichip module's high-density multilevel thin film packaging", Proc. SPIE 2991, Laser Applications in Microelectronic and Optoelectronic Manufacturing II, (9 May 1997); https://doi.org/10.1117/12.273739

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