Novel silicon cap package technology for monolithic microinertial measurement unit

Zhihong Li; Dacheng Zhang; Yilong Hao; Ting Li; Ying Wang; Guoying Wu

doi:10.1117/12.388914

21 June 2000 Novel silicon cap package technology for monolithic microinertial measurement unit

Zhihong Li, Dacheng Zhang, Yilong Hao, Ting Li, Ying Wang, Guoying Wu

Proceedings Volume 3990, Smart Structures and Materials 2000: Smart Electronics and MEMS; (2000) https://doi.org/10.1117/12.388914
Event: SPIE's 7th Annual International Symposium on Smart Structures and Materials, 2000, Newport Beach, CA, United States

Abstract

A monolithic micromachined inertial measurement unit (IMU), which combines three-degree-of-freedom gyroscope and a three-degree-of-freedom accelerometer, is attractive for navigation and guidance. A micromachined gyroscope generally works in a vacuum package to archive a high resolution. By contraries, a package of an accelerometer should provide proper dumping to optimize dynamic response. It is very difficult to fulfill two different package demands in one chip by using conventional package technology. We developed wafer-level silicon cap package technology to solve the problem. The gyroscope is completely sealed in a vacuum silicon cavity by anodic bonding in vacuum. The accelerometer is package din another silicon cavity, but different from the gyroscope, a 'bypass hole' is fabricated in the wall of the cavity. Using this technique, the accelerometer can operate in an air ambient, the damping is controlled by optimizing structure design of accelerometer and change the size of the bypass hole. Consequently, demands of package for both accelerometer and gyroscope are fulfilled. Besides, the silicon cap can protect fragile mechanical structures during post-releasing processing, such as dicing, mounting and wire bonding. Consequently, after the silicon cap is formed, the MEMS wafer can be treated as a common IC wafer. These structures were fabricated with wafer bonding and ICP deep etching technologies, but can be also fabricated by other micromachining technologies.

Citation Download Citation

Zhihong Li, Dacheng Zhang, Yilong Hao, Ting Li, Ying Wang, and Guoying Wu "Novel silicon cap package technology for monolithic microinertial measurement unit", Proc. SPIE 3990, Smart Structures and Materials 2000: Smart Electronics and MEMS, (21 June 2000); https://doi.org/10.1117/12.388914

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KEYWORDS

Silicon

Gyroscopes

Semiconducting wafers

Microelectromechanical systems

Glasses

Etching

Sensors

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