Paper
24 October 2000 Application of excimer laser annealing in the formation of ultrashallow p+/n junctions
Yung Fu Chong, Kin Leong Pey, Andrew Thye Shen Wee, Alex K. See, C. H. Tung, R. Gopalakrishnan, Yongfeng Lu
Author Affiliations +
Proceedings Volume 4227, Advanced Microelectronic Processing Techniques; (2000) https://doi.org/10.1117/12.405380
Event: International Symposium on Microelectronics and Assembly, 2000, Singapore, Singapore
Abstract
In this study, we have simulated the melt front and temperature distribution profiles for pre-amorphized Si during laser irradiation. The simulation data show that theoretically, it is possible to melt the whole amorphous layer without melting the underlying crystalline substrate. On the other hand, ultra-shallow p+/n junctions were formed by ultra-low energy boron ion implantation into pre- amorphized silicon substrates. Dopant activation was achieved via spike rapid thermal annealing (RTA) and pulsed excimer laser annealing. Secondary ion mass spectrometry analyses show that a step-like dopant profile can be obtained with a single-pulse laser irradiation. Such a profile is in sharp contrast with the boron concentration profile that is obtained after spike RTA. The cross- sectional transmission electron microscopy images show that the entire pre-amorphized layer has been recrystallized to single-crystalline Si after laser annealing. The results clearly indicate the advantages of employing laser anneal as compared to RTA in the fabrication of highly activated and abrupt ultra-shallow junctions.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yung Fu Chong, Kin Leong Pey, Andrew Thye Shen Wee, Alex K. See, C. H. Tung, R. Gopalakrishnan, and Yongfeng Lu "Application of excimer laser annealing in the formation of ultrashallow p+/n junctions", Proc. SPIE 4227, Advanced Microelectronic Processing Techniques, (24 October 2000); https://doi.org/10.1117/12.405380
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Cited by 4 scholarly publications.
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KEYWORDS
Annealing

Silicon

Boron

Semiconductor lasers

Excimer lasers

Ion implantation

Diffusion

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