Thermal signature for printed circuit board stress-failure diagnosis

Sheng-Jen Hsieh

doi:10.1117/12.420975

23 March 2001 Thermal signature for printed circuit board stress-failure diagnosis

Sheng-Jen Hsieh

Proceedings Volume 4360, Thermosense XXIII; (2001) https://doi.org/10.1117/12.420975
Event: Aerospace/Defense Sensing, Simulation, and Controls, 2001, Orlando, FL, United States

Abstract

To ensure the reliability of printed circuit boards, stress tests are typically applied throughout the manufacturing process to screen out weak/marginal boards. Existing tester diagnostic programs are used to detect failures and human technicians can then narrow down the source of the failure to a set of components. However, it is difficult to pinpoint the exact defective components. The objectives of this study were two-fold: (1) evaluate feasibility and applications of thermal signature for stress failure diagnosis; and (2) assess thermal signature portability at the component level. The stress failures under investigation were (1) stress test failure and (2) environmental stress screening test failure. Preliminary results suggest that thermal signature can be used as a diagnostic aid to technicians or engineers in diagnosing boards with stress failures. In addition, the same component, when placed on different boards or in different locations on the same board, has a similar thermal signature.

Citation Download Citation

Sheng-Jen Hsieh "Thermal signature for printed circuit board stress-failure diagnosis", Proc. SPIE 4360, Thermosense XXIII, (23 March 2001); https://doi.org/10.1117/12.420975

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