Paper
11 March 2002 Defects analysis of mask blanks
Dong-Heok Lee, Dae-Woo Kim, Jung-Kwan Lee, Woo-Gun Jeong, Sang-Soo Choi, Sung-Mo Jung, Soo-Hong Jeong
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Abstract
As photomask making procedures extend to more and more complex and difficult, the detected numbers of the quartz defects are increasing trend. These kinds of defects have been less detected frequently or not detected before. But, it can be found enough now because inspection machines are developed high resolution, short wavelength light source and low pixel size to find small size defects. Defect shapes and sizes detected by inspection machine are evaluated and classified to several types with SEM and then analyzed the wafer printing result with transmission data of the inspection and AIMS simulation result. By this analyzed result, the judge reference of the quartz defect was provided when the defect was detected by inspection machine during producing photomask. This will improve mask yield by reducing mask reject ratio classified blank mask defect problems.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Dong-Heok Lee, Dae-Woo Kim, Jung-Kwan Lee, Woo-Gun Jeong, Sang-Soo Choi, Sung-Mo Jung, and Soo-Hong Jeong "Defects analysis of mask blanks", Proc. SPIE 4562, 21st Annual BACUS Symposium on Photomask Technology, (11 March 2002); https://doi.org/10.1117/12.458336
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KEYWORDS
Photomasks

Inspection

Quartz

Semiconducting wafers

Scanning electron microscopy

Defect detection

Image transmission

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