Maleimide-based tetrapolymers for use in lift-off resists

Cindy X. Chen; Rodney J. Hurditch; Donald W. Johnson; Daniel J. Nawrocki

doi:10.1117/12.474224

24 July 2002 Maleimide-based tetrapolymers for use in lift-off resists

Cindy X. Chen, Rodney J. Hurditch, Donald W. Johnson, Daniel J. Nawrocki

Proceedings Volume 4690, Advances in Resist Technology and Processing XIX; (2002) https://doi.org/10.1117/12.474224
Event: SPIE's 27th Annual International Symposium on Microlithography, 2002, Santa Clara, California, United States

Abstract

Alkaline soluble maleimide based tetrapolymers which were prepared by free radical copolymerization are found to be suitable for use as non-imaginable resists in multilevel photolithographic processing. These materials offer widely variable undercut rates because of the ability to vary the composition during free radical polymerization and show little or no scumming when used in lift-off resist. This new polymer system may also be used as the base soluble resin in a photoresist formulation or a base soluble antiflective coating composition as well as used in making lift-off resists.

Citation Download Citation

Cindy X. Chen, Rodney J. Hurditch, Donald W. Johnson, and Daniel J. Nawrocki "Maleimide-based tetrapolymers for use in lift-off resists", Proc. SPIE 4690, Advances in Resist Technology and Processing XIX, (24 July 2002); https://doi.org/10.1117/12.474224

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