Micro/nano-DAC deformation measurement to analyze packaging components response to thermomechanical load

Dietmar Vogel; Astrid Gollhardt; Bernd Michel

doi:10.1117/12.462878

19 April 2002 Micro/nano-DAC deformation measurement to analyze packaging components response to thermomechanical load

Dietmar Vogel, Astrid Gollhardt, Bernd Michel

Proceedings Volume 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002; (2002) https://doi.org/10.1117/12.462878
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, 2002, Cannes-Mandelieu, France

Abstract

Thermo-mechanical reliability in advanced electronic, MEMS and MOEMS packaging requires additional material testing approaches. Namely, the necessary understanding of the impact of very local material stressing on component reliability leads to the need of material testing and characterization on microscopic and even on nanoscopic scale. E.g., defect initiation and propagation in multilayer structures applied in electronics, MEMS and MOEMS technology, the influence of material migration to mechanical behavior or defect development in ultra thin silicon dies often are not well understood. A key for micro material testing and characterization is the measurement of strains and displacements inside microscopic regions. Correlation techniques (e.g. micro DAC, nanoDAC) are one of the promising tools for that purpose. There application potentials to micro testing for packaging materials and components are demonstrated in the paper. More in detail approaches to CTE measurement, analysis of moisture-induced strains in polymers and crack testing are discussed. Furthermore, it is shown how the method can be used to study the mechanical response of complex micro components to thermo-mechanical loading.

Citation Download Citation

Dietmar Vogel, Astrid Gollhardt, and Bernd Michel "Micro/nano-DAC deformation measurement to analyze packaging components response to thermomechanical load", Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); https://doi.org/10.1117/12.462878

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $17.00

Non-members: $21.00 ADD TO CART

PROCEEDINGS
12 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY

GET CITATION

RIGHTS & PERMISSIONS

Get copyright permission Get copyright permission on Copyright Marketplace

KEYWORDS

Packaging

Photomicroscopy

Reliability

Temperature metrology

Microelectromechanical systems

Finite element methods

Silicon

Show All Keywords

Keywords/Phrases

Search In:

Publication Years