Thermal analysis of packaging device with metal-coated fiber Bragg grating

Baoxi X. Xu; Wanxun X. He; Lungtat Ng; Mingyu Y. Liu; Gaoqiang Q. Yuan; Hongxing X. Yuan; Chengwu W. An; Towchong C. Chong

doi:10.1117/12.528688

18 June 2004 Thermal analysis of packaging device with metal-coated fiber Bragg grating

Baoxi X. Xu, Wanxun X. He, Lungtat Ng, Mingyu Y. Liu, Gaoqiang Q. Yuan, Hongxing X. Yuan, Chengwu W. An, Towchong C. Chong

Author Affiliations +

Proceedings Volume 5349, Physics and Simulation of Optoelectronic Devices XII; (2004) https://doi.org/10.1117/12.528688
Event: Integrated Optoelectronic Devices 2004, 2004, San Jose, CA, United States

Abstract

The three-dimensional model of the packaging device is established based on ANSYS simulation platform. The thermal properties such as time response, axial and radial temperature distributions at different applied voltages are exhibited. With aids of Real Time Optical Spectrum Analyzing System and IR Camera System, time response of the device and axial temperature distribution along the coated fiber with intracore FBG are both demonstrated. Temperature responses to different applied voltages are achieved after measuring voltage induced wavelength shift and temperature dependent wavelength shift. Simulation shows results in agreement with those of experiment. Finally, regulations on length of the metal coating, size of the package, power consumption and tuning properties of the packaging device are discussed.

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Baoxi X. Xu, Wanxun X. He, Lungtat Ng, Mingyu Y. Liu, Gaoqiang Q. Yuan, Hongxing X. Yuan, Chengwu W. An, and Towchong C. Chong "Thermal analysis of packaging device with metal-coated fiber Bragg grating", Proc. SPIE 5349, Physics and Simulation of Optoelectronic Devices XII, (18 June 2004); https://doi.org/10.1117/12.528688

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