Paper
10 June 2004 Fiber-to-waveguide evanescent coupler for planar integration of silicon optoelectronic devices
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Abstract
We present a method for coupling from a single mode fiber, or fiber ribbon, into an SOI waveguide for integration with silicon opto-electronic circuits. The coupler incorporates the advantages of the tapered waveguides and prism couplers, yet offers the flexibility of planar integration. The coupler can be fabricated on a double polished silicon wafer using direct polishing or grayscale photolithography. Tapered waveguides or J-couplers are then used as lateral mode converters. An experimental setup with a rotational stage and a pneumatic plunger has been built for adjusting the incident angle and tunnel layer thickness, which are key factors in determining the coupling efficiency. When optimal coupling is achieved on the setup, the coupler can be packaged using epoxy bonding. Thus, a fiber-waveguide parallel coupler or connector can be easily constructed. Electromagnetic calculation predicts a coupling efficiency of 77%(-1.14dB insertion loss) for a silicon-to-silicon coupler with a uniform tunnel layer. The coupling efficiency is experimentally achieved to be 46%(-3.4dB insertion loss) excluding the loss in silicon and the reflections from the input surface and output facet.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Zhaolin Lu, Peng Yao, Sriram Venkataraman, David Pustai, Chunchen Lin, Garrett Schneider, Janusz Murakowski, Shouyuan Shi, and Dennis W. Prather "Fiber-to-waveguide evanescent coupler for planar integration of silicon optoelectronic devices", Proc. SPIE 5358, Photonics Packaging and Integration IV, (10 June 2004); https://doi.org/10.1117/12.526627
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Cited by 2 scholarly publications.
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KEYWORDS
Waveguides

Silicon

Polishing

Fiber couplers

Prisms

Electromagnetism

Optoelectronic devices

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