Radiation mode coupling between active and passive chips based on a self-formed compact polymer interconnect for single-mode chip-to-chip optoelectronic integration

Kung-Li Deng; Min-Yi Shih; Thomas B. Gorczyca; Todd Tolliver; Renato Guida; Matthew C. Nielsen; James Loman

doi:10.1117/12.529221

10 June 2004 Radiation mode coupling between active and passive chips based on a self-formed compact polymer interconnect for single-mode chip-to-chip optoelectronic integration

Kung-Li Deng, Min-Yi Shih, Thomas B. Gorczyca, Todd Tolliver, Renato Guida, Matthew C. Nielsen, James Loman

Author Affiliations +

Proceedings Volume 5358, Photonics Packaging and Integration IV; (2004) https://doi.org/10.1117/12.529221
Event: Integrated Optoelectronic Devices 2004, 2004, San Jose, CA, United States

Abstract

Based on radiation mode coupling through a self-formed polymer waveguide extension, efficient single-mode optical coupling can be achieved between active and passive chips while relaxing the stringent positioning requirements. A 20dB improvement can be achieved according to simulation results. Single-mode waveguides have been successfully demonstrated using GE photo-definable polymer materials.

Citation Download Citation

Kung-Li Deng, Min-Yi Shih, Thomas B. Gorczyca, Todd Tolliver, Renato Guida, Matthew C. Nielsen, and James Loman "Radiation mode coupling between active and passive chips based on a self-formed compact polymer interconnect for single-mode chip-to-chip optoelectronic integration", Proc. SPIE 5358, Photonics Packaging and Integration IV, (10 June 2004); https://doi.org/10.1117/12.529221

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