Paper
13 April 2005 Ultrafast nanoimprint lithography (Invited Paper)
Qiangfei Xia, Stephen Y. Chou
Author Affiliations +
Abstract
Both ultrafast thermal and photocurable nanoimprint lithography (NIL) are studied and high fidelity transfers of nanopatterns from molds to resists have been achieved. In ultrafast thermal NIL, we use a single excimer laser pulse to melt a NIL resist polymer and imprint it using a fused silica mold. The entire imprint process, from melting the polymer to completion of the imprint, takes less than 200 ns. This technique, termed laser assisted nanoimprint lithography (LAN), has patterned nanostructures in various polymer films with high fidelity over the entire mold area. In LAN, the short laser pulse is absorbed primarily by the resist and the laser energy is minute, hence substrate heating and distortion are negligible. In ultrafast photocurable NIL, a flash lamp (pulse width 94 μs) is used to crosslink photo curable resists over a 4 in. wafer with high uniformity by a single pulse. The significant reduction of the heating of the substrate and mold will greatly benefit overlay alignment.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Qiangfei Xia and Stephen Y. Chou "Ultrafast nanoimprint lithography (Invited Paper)", Proc. SPIE 5725, Ultrafast Phenomena in Semiconductors and Nanostructure Materials IX, (13 April 2005); https://doi.org/10.1117/12.591158
Lens.org Logo
CITATIONS
Cited by 1 scholarly publication.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Nanoimprint lithography

Polymers

Silicon

Local area networks

Ultrafast phenomena

Absorption

Pulsed laser operation

Back to Top