Paper
8 June 2005 Micro-machining for industrial applications
Mohammed Naeem, Peter Collins
Author Affiliations +
Abstract
The increasing complexity of microelectronics/ engineering devices and the requirement for higher yields and automated production systems place stringent demands on the assembly techniques and performance requirements of materials, machining and joining techniques. This has led to increasing interest in the use of low power lasers for machining, welding, soldering and marking of small assemblies. Of particular interest to micro-component industries is the ability of such lasers to apply controlled amounts of energy in precise areas, utilizing extremely low heat input, resulting in very low distortion, and coupled with the ability to operate at high production rates in a flexible manner. The majority of these applications comprise thin materials, less than 1mm thickness. This paper describes some of the cutting, joining, drilling and marking results achieved with a high beam quality low power pulsed Nd: YAG laser.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mohammed Naeem and Peter Collins "Micro-machining for industrial applications", Proc. SPIE 5827, Opto-Ireland 2005: Photonic Engineering, (8 June 2005); https://doi.org/10.1117/12.605300
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Laser cutting

Laser marking

Pulsed laser operation

Laser drilling

Laser welding

Semiconductor lasers

Neodymium

RELATED CONTENT

Laser drilling up to 15,000 holes sec in silicon wafer...
Proceedings of SPIE (September 16 2013)
Study on the process of silicon wafer marking with 532nm...
Proceedings of SPIE (December 16 2022)
Precision Laser Micromachining
Proceedings of SPIE (July 07 1986)
Overview of laser applications the state of the art...
Proceedings of SPIE (February 19 2003)

Back to Top