From magic to technology: materials integration by wafer bonding

Viorel Dragoi

doi:10.1117/12.646450

24 February 2006 From magic to technology: materials integration by wafer bonding

Viorel Dragoi

Proceedings Volume 6123, Integrated Optics: Devices, Materials, and Technologies X; 612314 (2006) https://doi.org/10.1117/12.646450
Event: Integrated Optoelectronic Devices 2006, 2006, San Jose, California, United States

Abstract

Wafer bonding became in the last decade a very powerful technology for MEMS/MOEMS manufacturing. Being able to offer a solution to overcome some problems of the standard processes used for materials integration (e.g. epitaxy, thin films deposition), wafer bonding is nowadays considered an important item in the MEMS engineer toolbox. Different principles governing the wafer bonding processes will be reviewed in this paper. Various types of applications will be presented as examples.

Citation Download Citation

Viorel Dragoi "From magic to technology: materials integration by wafer bonding", Proc. SPIE 6123, Integrated Optics: Devices, Materials, and Technologies X, 612314 (24 February 2006); https://doi.org/10.1117/12.646450

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