Energy variation of micro-cracking on single crystal silicon

F. Z. Fang; Y. C. Liu

doi:10.1117/12.694415

10 June 2006 Energy variation of micro-cracking on single crystal silicon

F. Z. Fang, Y. C. Liu

Proceedings Volume 6344, Advanced Laser Technologies 2005; 63441M (2006) https://doi.org/10.1117/12.694415
Event: Advanced Laser Technologies 2005, 2005, Tianjin, China

Abstract

The results from nano indentation is employed to study the mechanical behaviour of materials at nanometric scale. Based on the extensive experiments using nano indentation, a new phenomenon is discovered in understanding micro cracking on single crystal silicon. Thus, a new method is proposed in evaluating the micro cracks occurring, i.e., an increasing rate of absorbed energy, which is significant in examining the brittle-to-ductile transition of single crystal silicon. This method provides a simple approach in understanding the micro cracks, while it is very tedious in conventional method. Experimental studies reveal that the increasing rate of absorbed energy in nano indentation presents an identical correlation to the surface cracks on single crystal silicon surfaces.

Citation Download Citation

F. Z. Fang and Y. C. Liu "Energy variation of micro-cracking on single crystal silicon", Proc. SPIE 6344, Advanced Laser Technologies 2005, 63441M (10 June 2006); https://doi.org/10.1117/12.694415

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available