Paper
21 June 2006 Analytic and laser vibrometry study of squeeze film damping of MEMS cantilevers
Joseph F. Vignola, John A. Judge, Eric Lawrence, Jacek Jarzynski, Brian Houston
Author Affiliations +
Proceedings Volume 6345, Seventh International Conference on Vibration Measurements by Laser Techniques: Advances and Applications; 63451C (2006) https://doi.org/10.1117/12.693065
Event: Seventh International Conference on Vibration Measurements by Laser Techniques: Advances and Applications, 2006, Ancona, Italy
Abstract
This study compares theoretical predictions to experimental measurements of squeeze film damping of MEMS cantilevers in a fluid environment. A series of MEMS cantilevers were fabricated on a silicon wafer. Each of the silicon beams was 2 μm thick and 18 μm wide. The lengths range from 100 to 800 μm and the air-filled gap between the cantilever and the substrate was 6 μm. An analytic model for squeeze film damping was used to predict the corresponding quality factor Qsqueeze film (the ratio of the mechanical energy stored in the oscillator to the energy dissipated per cycle) for these cantilevers. The results from the modeling are compared to experimental results obtained using a Polytec MSA-400 Micro System Analyzer.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Joseph F. Vignola, John A. Judge, Eric Lawrence, Jacek Jarzynski, and Brian Houston "Analytic and laser vibrometry study of squeeze film damping of MEMS cantilevers", Proc. SPIE 6345, Seventh International Conference on Vibration Measurements by Laser Techniques: Advances and Applications, 63451C (21 June 2006); https://doi.org/10.1117/12.693065
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Cited by 3 scholarly publications.
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KEYWORDS
Microelectromechanical systems

Oscillators

Vibrometry

Acoustics

Microfluidics

Data modeling

Silicon

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