Ordered DNA arrays prepared via soft lithography

Mashiur Rahman; B. Scott Day; Huan Cao; Heather Butts; Michael L. Norton

doi:10.1117/12.685706

19 October 2006 Ordered DNA arrays prepared via soft lithography

Mashiur Rahman, B. Scott Day, Huan Cao, Heather Butts, Michael L. Norton

Proceedings Volume 6370, Nanomaterial Synthesis and Integration for Sensors, Electronics, Photonics, and Electro-Optics; 637012 (2006) https://doi.org/10.1117/12.685706
Event: Optics East 2006, 2006, Boston, Massachusetts, United States

Abstract

This paper reports progress in an approach to create a general purpose platform to be used in the reproducible assembly of molecular electronic devices. We describe a method in which DNA molecules were immobilized on patterned neutravidin surfaces. First, a silicon wafer was functionalized with (3- aminopropyl)triethoxysilane (APTES) to produce an amine-terminated surface. The primary amine group was then reacted with the heterobifunctional linker molecule succinimidyl-6-(biotinamido)hexanoate which placed an active biotin group at the surface interface. These biotinylated surfaces were then patterned with the tetrameric protein neutravidin using microcontact printing (μCP) with relief features in polydimethylsiloxane (PDMS) stamps. The neutravidin proteins adsorb onto the surface and bind nearly irreversibly to one or two biotin groups leaving at least two biotin binding sites on each protein available for conjugation. Following neutravidin stamping, 1 μm long DNA molecules functionalized on one end with biotin were attached to the patterned areas. Water contact angle (WCA) measurements were used to characterize wettability changes of the silicon surfaces for amine and biotin functionalization. Atomic force microscopy (AFM) was used to image the patterns of immobilized neutravidin and DNA.

Citation Download Citation

Mashiur Rahman, B. Scott Day, Huan Cao, Heather Butts, and Michael L. Norton "Ordered DNA arrays prepared via soft lithography", Proc. SPIE 6370, Nanomaterial Synthesis and Integration for Sensors, Electronics, Photonics, and Electro-Optics, 637012 (19 October 2006); https://doi.org/10.1117/12.685706

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