Paper
15 March 2007 EUVL mask dual pods to be used for mask shipping and handling in exposure tools
Yoshio Gomei, Kazuya Ota, John Lystad, Dave Halbmair, Long He
Author Affiliations +
Abstract
The concept of Extreme Ultra-Violet Lithography (EUVL) mask dual pods is proposed for use in both mask shipping and handling in exposure tools. The inner pod was specially designed to protect masks from particle contamination during shipping from mask houses to wafer factories. It can be installed in a load-lock chamber of exposure tools and evacuated while holding the mask inside. The inner pod upper cover is removed just before the mask is installed to a mask stage. Prototypes were manufactured and tested for shipping and for vacuum cycling. We counted particle adders through these actions with a detectable level of 54 nm and up. The adder count was close to zero, or we can say that the obtained result is within the noise level of our present evaluation environment. This indicates that the present concept is highly feasible for EUVL mask shipping and handling in exposure tools.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yoshio Gomei, Kazuya Ota, John Lystad, Dave Halbmair, and Long He "EUVL mask dual pods to be used for mask shipping and handling in exposure tools", Proc. SPIE 6517, Emerging Lithographic Technologies XI, 65170W (15 March 2007); https://doi.org/10.1117/12.711296
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CITATIONS
Cited by 8 scholarly publications.
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KEYWORDS
Photomasks

Particles

Extreme ultraviolet lithography

Particle contamination

Semiconducting wafers

Pellicles

Prototyping

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