Paper
15 February 2008 Efficient micro machining with high average power picosecond lasers
S. Weiler, U. Stute, S. Massa, S. Buettner, B. Faisst
Author Affiliations +
Abstract
Picosecond pulses are ideal for processing of materials where thermal influence must be minimized. Furthermore, for ps pulse durations, the technical approach to generating the pulses can be greatly simplified, allowing average output powers of 50 W at the fundamental wavelength of 1030 nm. We report on the latest results for efficient micro machining. Fundamental investigations show the measured ablation thresholds for the most convenient materials (i.e. Fe, SS, Al, Cu, Brass, Si, NiTi, etc.) and the measured transition from so called optical ablation to thermal ablation. By using these results we optimized micro machining processes, like cutting, drilling and thin film ablation with ps pulses.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
S. Weiler, U. Stute, S. Massa, S. Buettner, and B. Faisst "Efficient micro machining with high average power picosecond lasers", Proc. SPIE 6881, Commercial and Biomedical Applications of Ultrafast Lasers VIII, 68811B (15 February 2008); https://doi.org/10.1117/12.761770
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Cited by 3 scholarly publications.
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KEYWORDS
Picosecond phenomena

Silicon

Laser ablation

Thin films

Aluminum

Copper

Laser cutting

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