glassPack: a novel photonic packaging and integration technology using thin glass foils

Lars Brusberg; Henning Schröder; Norbert Arndt-Staufenbiel; Maik Wiemer

doi:10.1117/12.780867

14 May 2008 glassPack: a novel photonic packaging and integration technology using thin glass foils

Lars Brusberg, Henning Schröder, Norbert Arndt-Staufenbiel, Maik Wiemer

Author Affiliations +

Proceedings Volume 6992, Micro-Optics 2008; 699206 (2008) https://doi.org/10.1117/12.780867
Event: SPIE Photonics Europe, 2008, Strasbourg, France

Abstract

"glassPack" will be introduced as a novel photonic packaging concept for a wide area of applications like high-speed electronic systems and sensors. The usage of thin glass foils with a thickness of some tens of microns as substrate and interconnection material will be discussed. Photonic packaging in such hybrid optoelectronic systems involves single packages, modules, and subsystems comprising at least one optoelectronic device, micro-optical element or optical interconnection. Thin glass is a commercially available and reliable material with high thermal resistance and excellent optical properties. Because glass is a well known material, many technologies like polishing, plating, etching and refractive index tuning are already known. In combination with newly developed integration technologies, a complete glass based package on wafer level can be realized. The main ideas of the "glassPack" concept are: selection of suitable glass foils as substrate material, realization of microsystem compatible structuring technologies like cutting, drilling and etching, integration of optical waveguides by ion-exchange for single- and multi-mode applications, implementation of optical interconnects between fibres and integrated waveguides by laser fusion, integration of electrical wires and feed throughs, assembly of electronic and optoelectronic components, and bonding of the thin glass foils to 3D-stacks. Furthermore, the integration of micro fluidic channels into a "glassPack" will be supported. A sensor module containing optical waveguides, fluidic channels, electrical wires and components like a laser, two photodiodes and two flip-chips will be presented to demonstrate the suitability of glass as a material for integrated microsystems.

Citation Download Citation

Lars Brusberg, Henning Schröder, Norbert Arndt-Staufenbiel, and Maik Wiemer "glassPack: a novel photonic packaging and integration technology using thin glass foils", Proc. SPIE 6992, Micro-Optics 2008, 699206 (14 May 2008); https://doi.org/10.1117/12.780867

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