Paper
19 May 2008 Application of two-fluid nozzles for advanced photomask cleaning process
Kenji Masui, Tetsuo Takemoto, Kyo Otsubo, Mari Sakai, Tomotaka Higaki, Hidehiro Watanabe, Tsutomu Kikuchi, Yoshiaki Kurokawa
Author Affiliations +
Abstract
Damage to minute features of 45nm-node device masks occurred during megasonic cleaning. Since we were obliged to weaken the mechanical effect of megasonics in order to prevent the collapse of minute features, we could not obtain acceptable cleaning results. In order to manage the minute features, there is a need to develop a new mechanical cleaning method that causes less damage, but does not compromise the ability to remove particles. Cleaning using a two-fluid nozzle is a promising candidate. We investigated the two-fluid nozzle and compared it with megasonic cleaning, and we confirmed that the two-fluid nozzle achieved acceptable cleaning results without damaging 45nm-node device masks. Furthermore, for 32nm-node device masks, we have improved the two-fluid nozzle in terms of the cleaning energy distribution.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kenji Masui, Tetsuo Takemoto, Kyo Otsubo, Mari Sakai, Tomotaka Higaki, Hidehiro Watanabe, Tsutomu Kikuchi, and Yoshiaki Kurokawa "Application of two-fluid nozzles for advanced photomask cleaning process", Proc. SPIE 7028, Photomask and Next-Generation Lithography Mask Technology XV, 702809 (19 May 2008); https://doi.org/10.1117/12.793018
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CITATIONS
Cited by 2 scholarly publications.
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KEYWORDS
Particles

Photomasks

Mask cleaning

Liquids

Mechatronics

Phase measurement

Velocity measurements

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