Advanced-UV excimer laser processing

Ralph Delmdahl

doi:10.1117/12.807981

19 February 2009 Advanced-UV excimer laser processing

Ralph Delmdahl

Proceedings Volume 7196, High Energy/Average Power Lasers and Intense Beam Applications III; 719608 (2009) https://doi.org/10.1117/12.807981
Event: SPIE LASE: Lasers and Applications in Science and Engineering, 2009, San Jose, California, United States

Abstract

High energy excimer lasers lend maximum flexibility to laser microprocessing, since virtually every material is amenable to accurate, high resolution material ablation without subsequent post treatment. Due to the UV photons provided with no up-conversion required as direct output by excimer lasers, output powers of many hundred watts are easily achievable and are key to high throughput, and up-scaling capability of manufacturing processes. In particular, the large flat-top excimer laser profile is well-suited for most efficient parallel processing of two and three dimensional microstructures. Compact micromachining concepts particularly suited for material ablation and surface activation will be introduced.

Citation Download Citation

Ralph Delmdahl "Advanced-UV excimer laser processing", Proc. SPIE 7196, High Energy/Average Power Lasers and Intense Beam Applications III, 719608 (19 February 2009); https://doi.org/10.1117/12.807981

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