Improved device bonding performance: precise placement with appropriate thermal and atmospheric control

Robert Avila; Saul McLeod

doi:10.1117/12.810550

17 February 2009 Improved device bonding performance: precise placement with appropriate thermal and atmospheric control

Robert Avila, Saul McLeod

Author Affiliations +

Proceedings Volume 7221, Photonics Packaging, Integration, and Interconnects IX; 72210X (2009) https://doi.org/10.1117/12.810550
Event: SPIE OPTO: Integrated Optoelectronic Devices, 2009, San Jose, California, United States

Abstract

In any assembly, where two devices are to be precisely connected, the integrity and quality of this connection (bond) is a key factor in the overall performance of the final device. In micro-assembly and optoelectronics, this connection is typically gold to gold, solder, or epoxy bond. The chemistries can vary, but the critical issues remain the same. Placement accuracy is an important consideration and is normally the starting point for most bonding applications. In optoelectronics, the placement of a laser will be critical to its performance. Often edge-to-edge alignment is needed, which requires optical resolution of one micron or better. Laser bars have the added challenge of requiring this high optical resolution, but over distances of more than 10 millimeters. Equally important is what happens after a device has been aligned to a substrate ready for bonding. Both thermal and force parameters must be considered. Voiding in the material or oxidation during the soldering process all need to be minimized. This paper will look at recent innovations to improve the final bond. These innovations include temperature ramp rate, heated inert atmosphere and component uniformity. These processing techniques are particularly applicable in optoelectronics applications, such as laser diode and laser bar bonding.

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Robert Avila and Saul McLeod "Improved device bonding performance: precise placement with appropriate thermal and atmospheric control", Proc. SPIE 7221, Photonics Packaging, Integration, and Interconnects IX, 72210X (17 February 2009); https://doi.org/10.1117/12.810550

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