Laser beam shaping and packaging system

Daxin Luo; Baiqin Zhao

doi:10.1117/12.976862

16 October 2012 Laser beam shaping and packaging system

Daxin Luo, Baiqin Zhao

Proceedings Volume 8416, 6th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies; 84161U (2012) https://doi.org/10.1117/12.976862
Event: 6th International Symposium on Advanced Optical Manufacturing and Testing Technologies (AOMATT 2012), 2012, Xiamen, China

Abstract

This paper presents a semiconductor laser beam shaping system, that can collimate the irradiance profile effectively and package the laser diode(LD) at the same time. Due to the semiconductor LD is a kind of line source, a particular ellipsoidal lens is designed after both the fast-axis and the slow-axis of the laser beam analyzed. Geometrical optics analysis based on the ray tracing method is done and the formulas to calculate the shape of the lens are given. Both the theoretical and experimental result show that the laser beam system works effectively; the divergence angle is reduced to less than 0.5 degree in the fast-axial direction and 1.8 degree in the slow-axial direction. In addition, it is the same process that makes the laser beam shaper and packages the LD by using epoxy resin, which simplifies the manufacturing process and reduces the LD volume greatly. Because of the advantages of small volume, low-cost, high rigidity and easy fabrication, the shaper is of great value in the field of semiconductor LD applications.

Citation Download Citation

Daxin Luo and Baiqin Zhao "Laser beam shaping and packaging system", Proc. SPIE 8416, 6th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 84161U (16 October 2012); https://doi.org/10.1117/12.976862

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