Computational defect review for actinic mask inspections

Paul Morgan; Daniel Rost; Daniel Price; Noel Corcoran; Masaki Satake; Peter Hu; Danping Peng; Dean Yonenaga; Vikram Tolani

doi:10.1117/12.2013901

10 April 2013 Computational defect review for actinic mask inspections

Paul Morgan, Daniel Rost, Daniel Price, Noel Corcoran, Masaki Satake, Peter Hu, Danping Peng, Dean Yonenaga, Vikram Tolani

Author Affiliations +

Proceedings Volume 8681, Metrology, Inspection, and Process Control for Microlithography XXVII; 868122 (2013) https://doi.org/10.1117/12.2013901
Event: SPIE Advanced Lithography, 2013, San Jose, California, United States

Abstract

As optical lithography continues to extend into low-k1 regime, resolution of mask patterns continues to diminish. The limitation of 1.35 NA posed by water-based lithography has led to the application of various resolution enhancement techniques (RET), for example, use of strong phase-shifting masks, aggressive OPC and sub-resolution assist features, customized illuminators, etc. The adoption of these RET techniques combined with the requirements to detect even smaller defects on masks due to increasing MEEF, poses considerable challenges for a mask inspection engineer. Inspecting masks under their actinic-aerial image conditions would detect defects that are more likely to print under those exposure conditions. However, this also makes reviewing such defects in their low-contrast aerial images very challenging. On the other hand, inspecting masks under higher resolution inspection optics would allow for better viewing of defects post-inspection. However, such inspections generally would also detect many more defects, including printable and nuisance, thereby making it difficult to judge which are of real concern for printability on wafer. Often, an inspection engineer may choose to use Aerial and/or high resolution inspection modes depending on where in the process flow the mask is and the specific device-layer characteristics of the mask. Hence, a comprehensive approach is needed in handling defects both post-aerial and post-high resolution inspections. This analysis system is designed for the Applied Materials Aera™ mask inspection platform, all data reported was collected using the Aera.

Citation Download Citation

Paul Morgan, Daniel Rost, Daniel Price, Noel Corcoran, Masaki Satake, Peter Hu, Danping Peng, Dean Yonenaga, and Vikram Tolani "Computational defect review for actinic mask inspections", Proc. SPIE 8681, Metrology, Inspection, and Process Control for Microlithography XXVII, 868122 (10 April 2013); https://doi.org/10.1117/12.2013901

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