Paper
23 August 2013 An algorithm for restoring the wafer surface based on B-spline surface reconstruction
Nan Wang, Wei Jiang, Wei Yan, Song Hu
Author Affiliations +
Proceedings Volume 8911, International Symposium on Photoelectronic Detection and Imaging 2013: Micro/Nano Optical Imaging Technologies and Applications; 89110G (2013) https://doi.org/10.1117/12.2034199
Event: ISPDI 2013 - Fifth International Symposium on Photoelectronic Detection and Imaging, 2013, Beijing, China
Abstract
Project lithography has experienced the development of contact, stepper, and step and scan lithography machine. Currently lithography machine has entered the age of twinscan lithography machine. The twinscan lithography machine took advantages of high efficiency and good compatibility, but the focal depth of twinscan lithography machine was only in the nanometer range. In order to guarantee the quality of the exposure, the twinscan lithography machine put forward high request for detecting the map of the wafer surface. Usually, the uniform sampling method and the whole map rebuilding method were used to detect the map of the silicon wafer surface, which is a main cause for the data redundancy. On the other hand, the map reconstructed by this means was not smooth which caused the motor of lithography machine can't response. To avoid these disadvantages, an algorithm for restoring the wafer surface based on B-spline surface reconstruction is proposed in this paper. This method is able to satisfy requirements for the local adaptive refinement, which effectively avoid data redundancy. This method is robust, which means the effect of solving nonlinear problems and inhibiting fuzzy noise is remarkable. The surface reconstructed by this new method is very smooth, which is more suitable for the movement of the motor in lithography machine.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Nan Wang, Wei Jiang, Wei Yan, and Song Hu "An algorithm for restoring the wafer surface based on B-spline surface reconstruction", Proc. SPIE 8911, International Symposium on Photoelectronic Detection and Imaging 2013: Micro/Nano Optical Imaging Technologies and Applications, 89110G (23 August 2013); https://doi.org/10.1117/12.2034199
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Semiconducting wafers

Lithography

Reconstruction algorithms

Clouds

Fuzzy logic

Integrated circuits

Optics manufacturing

RELATED CONTENT

MAPPER alignment sensor evaluation on process wafers
Proceedings of SPIE (March 26 2013)
MAPPER: high throughput maskless lithography
Proceedings of SPIE (April 03 2008)
On the evolution of wafer level cameras
Proceedings of SPIE (February 14 2011)
Micro integration of VCSELs, detectors, and optics
Proceedings of SPIE (April 30 1999)
Focusing and leveling in dual stage lithographic system
Proceedings of SPIE (October 22 2010)

Back to Top